A report by The Information claims that the world’s biggest chipmaker is considering adding memory back into its portfolio, starting with next-generation 3D DRAM. With demand still outpacing supply and prices sky-high, the outlet says it could compete with memory giants Micron, Samsung, and SK Hynix to develop and produce 3D DRAM technology that stacks chips vertically for increased bandwidth, capacity, and power efficiency. [Link: TSMC Weighs Making Advanced Memory Chips to Capture More AI Spending | https://www.theinformation.com/articles/tsmc-weighs-making-advanced-memory-chips-capture-ai-spending?rc=v4bmzs | The Information]
  • Echo Dot@feddit.ukEnglish
    1·
    2 days ago

    Yeah I don’t work in anything customer facing but I’m pretty sure all the work we do comes from meetings and signed agreements. I guess it might start out with an email but we certainly wouldn’t do any work just off the back of an email exchange.

    Sometimes new service agents will copy and paste an email into a ticket and escalate that, but we always kick it back telling them to file via the service catalog. Then we’ll get right on it, in 6 days.